Especificações técnicas leds de potencia Z7

7/30/2019 Especificaes tcnicas leds de potencia Z7

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Z7Z7

(Rev.(Rev. 03)03)

March.March. 20122012

www.seoulsemicon.comwww.seoulsemicon.com

Specification

Z7

SSC Customer

Drawn Approval Approval

RoHS


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[ Contents ]

1. Description

2. Full code of Z7 series3. Outline dimension

4. Characteristics of Z7

5. Characteristic diagrams

6. CIE Chromaticity Diagram

7. Binning Table8. Labeling

9. Reel Packing

8. Recommended solder pad

9. Soldering profile

10. Precaution for Use

11. Revision Profile

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Document number : SSC-QP-7-07-25 (Rev.00)

Z7Z7

(Rev.(Rev. 03)03)



Z7

Features

Applications

Z7

* The appearance and specifications of the product can be changedfor improvement without notice.

The Z-Power series is designed for high

current operation and high flux output

applications. It incorporates state of the

art SMD design and low thermal resistant

material.

The Z Power LED is ideal light sources for general illumination

applications, custom designed solutions, automotive, large LCD

backlights and high performance torches.

Super high Flux output

and high Luminance

Designed for high

current operation

SMT solderable

Lead Free product

RoHS compliant

General Torch

Architectural lighting

Task lighting

Decorative / Pathway

lighting

Remote / Solar

powered lighting

Street lighting

Description


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Full code of Z7 series

X1 Company S SSC

X2 Package series Z Z-Power

X3Color

WPure White

X4 0

X5

Z-Power series number 7 Z7 series

X6 Lens type A Dome-Wide

X7 PCB type 0 Emitter

X8 Revision No. A Rev0

X9X10 Luminous flux - -

X11X12 Color bin - -

X13 Forward Voltage - -

1. Part Number Form : X1X2X3X4X5X6X7X8 X9X10X11X12X13

2. Sticker Diagram on Reel & Aluminum Vinyl Bag

QUANTITY : 500

SSC PART NUMBER : X1X2X3X4X5X6X7X8

Lot No : #########

Rank :

X1X2X3X4X5X6X7X8

X9X10X11X12X13


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Outline dimensions

Notes :

[1] All dimensions are in millimeters.

[2] Scale : none[3] Undefined tolerance is 0.2mm

[INNER CIRCIT DIAGRAM]


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Characteristics of Z7 (SZW07A0A)

1. Pure white

1-1 Electro-Optical characteristics at 1400mA

1-2 Absolute Maximum Ratings

Parameter SymbolValue

UnitMin Typ Max

Luminous Flux [1] V[2] 390 490 530 lm

Correlated Color Temperature [3] CCT 4700 6000 8200 K

CRI Ra 65 70 75 -

Forward Voltage[4]

VF - 3.3 4 VThermal resistance (J to S) [6] RJ-S 1.6 K/W

View Angle 2 130 deg.

Parameter Symbol Value Unit

Forward Current IF 2800 (each chip 700mA) mA

Reverse Voltage V 5 V

Power Dissipation Pd 11 W

Junction Temperature Tj 135

Operating Temperature Topr -40 ~ +85

Storage Temperature Tstg -40 ~ +100

ESD Sensitivity [5] - 3,000V HBM -

*Notes :

[1] SSC maintains a tolerance of10% on flux and power measurements.

[2] V is the total luminous flux output as measured with an integrating sphere.

[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.

CCT 5% tolerance.

[4] Tolerance is 0.06V on forward voltage measurements

[5] A zener diode is included to protect the product from ESD.

[6] At thermal Resistance, J to S means junction to solder point on metal PCB.

(Ta=25, RH30%)


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Characteristics of Z7 (SZWW7A0A)

1. Warm white

1-1 Electro-Optical characteristics at 1400mA

1-2 Absolute Maximum Ratings

Parameter SymbolValue

UnitMin Typ Max

Luminous Flux [1] V[2] 290 355 410 lm

Correlated Color Temperature [3] CCT - 3000 - K

CRI Ra - 80 - -

Forward Voltage [4] VF 3.3 4 V

Thermal resistance (J to S) [6] RJ-S 1.6 K/W

View Angle 2 130 deg.

Parameter Symbol Value Unit

Forward Current IF 2800 (each chip 700mA) mA

Reverse Voltage V 5 V

Power Dissipation Pd 11 W

Junction Temperature Tj 135

Operating Temperature Topr -40 ~ +85

Storage Temperature Tstg -40 ~ +100

ESD Sensitivity [5] - 3,000V HBM -

*Notes :

[1] SSC maintains a tolerance of10% on flux and power measurements.

[2] V is the total luminous flux output as measured with an integrating sphere.[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.

CCT 5% tolerance.

[4] Tolerance is 0.06V on forward voltage measurements

[5] A zener diode is included to protect the product from ESD.

[6] At thermal Resistance, J to S means junction to solder point on metal PCB.


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Color Spectrum

300 400 500 600 700 800 900

0.0

0.5

1.0

1.5

2.0

2.5

RelativeSpectralPowerSpectrum

Wavelength [nm]

Pure

Warm

(IF=350mA, Ta=25 , RH 30%)


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0 400 800 1200 1600 2000 2400 28000.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

RelativeLuminous

Flux(X100,%)

Forward Current (mA)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0-400

0

400

800

1200

1600

2000

2400

2800

ForwardCurrent[mA]

Forward Voltage [V]

Forward Current vs. Normalized Relative Luminous Flux, Ta=25

Forward Voltage vs. Forward Current, Ta=25

Forward Current Characteristics


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0 500 1000 1500 2000 2500 3000

3000

4000

5000

6000

7000

CCT

[K]

Current [mA]

Pure

Warm

Chromaticity Coordinate vs. Forward Current, Ta=25

CCT vs. Forward Current, Ta=25

0 400 800 1200 1600 2000 2400 2800

-0.006

-0.003

0.000

0.003

0.006

0.009

0.012

ChromaticityCoordinate

Current [mA]

Pure x-axis

Pure y-axis

Warm x-axis

Warm y-axis


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25 50 75 100 125 150-1.0

-0.8

-0.6

-0.4

-0.2

0.0

ForwardVo

ltageShift[V]

Junction Temperature [Celcius]

Junction Temperature Characteristics

Relative Light Output vs. Junction Temperature at IF=1400mA

VF vs. Junction Temperature at IF=350mA

25 50 75 100 125 1500

20

40

60

80

100

RelativeLum

inousOutput[%]



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CCT vs. Junction Temperature at IF=350mA

Chromaticity Coordinate vs. Junction Temperature at IF=350mA

25 50 75 100 125 150-0.015

-0.012

-0.009

-0.006

-0.003

0.000

0.003

0.006

0.009

0.012

0.015

Chromatic

ityCoordinate


Pure x-axis

Pure y-axis

Warm x-axis

Warm y-axis

25 50 75 100 125 150

3000

4000

5000

6000

7000

8000

CCT[K]


Pure

Warm


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0 20 40 60 80 1000

200

400

600

800

1000

1200

1400

1600

Fordward

Current(mA)

Ambient Temperature(C)

0 20 40 60 80 1000

500

1000

1500

2000

2500

3000

ForwardC

urrent(mA)

Ambient Temperature(C)

Ambient Temperature vs. Allowable Forward Current@1400mA

Rj-a=10 /W

Rj-a=15 /W

Rj-a=20 /W

Rj-a=8 /W

Rj-a=10 /W

Rj-a=12 /W

Ambient Temperature vs. Allowable Forward Current@2800mA


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Radiation pattern @1400mA

-90 -60 -30 0 30 60 900.0

0.2

0.4

0.6

0.8

1.0

RelativeLumin

ousIntensity

Angle [degree]


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CIE Chromaticity Diagram (Pure)

IF=1400mA, Ta=25


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CIE Chromaticity Diagram (Warm)

IF=1400mA, Ta=25


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Binning Table

Luminous Flux (lm)

@ IF= 1400mA

BinCode

Min. Max.

Y2 290 340

Z1 340 390

Z2 390 440

A1 440 490

A2 490 540

Bin Code

Luminous Flux (lm)

@ IF= 1400mA

Color Chromaticity Coordinate

@ IF= 1400mA

Forward Voltage (V)

@ IF= 1400mA

V2 C2 H

Available ranks

Forward Voltage(V)

@ IF= 1400mA

BinCode

Min. Max.

G 2.75 3.00

H 3.0 3.25

I 3.25 3.5

J 3.5 3.75

K 3.6 3.8

Color Chromaticity Coordinate

@ IF= 1400mA

Bin

CodeMin. Max.

Ref. 15, 16 pages


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Label

X9X10X11X12X13

- X9X10 : Luminous Flux : LF [lm]

- X11X12 : Color Coordinates : x, y

- X13 : Forward Voltage : VF [V]

Rank

X1X2X3X4X5X6X7X8

- X1 : Company

- X2 : Z-Power LED series number

- X3X4 : Color

- X5 : Series number

- X6 : Lens type

- X7 : PCB type

- X8 : Revision number

Full code form :

QUANTITY : 500

SSC PART NUMBER : SZDW7A0A

Lot No : #########

Rank :

SZDW7A0A

X9X10X11X12X13

: SZW07A0A


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Emitter Carrier & Reel Packaging


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Recommended solder pad

Notes :

[1] All dimensions are in millimeters.

[2] Scale : none[3] This drawing without tolerances are for reference only[4] Recommended solder paste height : 30um

Solder Pad

Isolation


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Reflow Soldering Conditions / Profile

* Caution1. Reflow soldering should not be done more than one time.2. Repairs should not be done after the LEDs have been soldered. When

repair is unavoidable, suitable tools must be used.3. Die slug is to be soldered.4. When soldering, do not put stress on the LEDs during heating.5. After soldering, do not warp the circuit board.6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.

IPC/JEDEC J-STD-020C

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp) 3 C/second max. 3 C/second max.

Preheat

- Temperature Min (Tsmin)- Temperature Max (Tsmax)- Time (Tsmin to Tsmax) (ts)

100C150 C

60-120 seconds

150C200 C

60-180 seconds

Time maintained above:- Temperature (TL)- Time (tL)

183 C60-150 seconds

217 C60-150 seconds

Peak Temperature (Tp) 215 260

Time within 5C of actual PeakTemperature (tp)2

10-30 seconds 20-40 seconds

Ramp-down Rate 6 C/second max. 6 C/second max.

Time 25C to Peak Temperature 6 minutes max. 8 minutes max.


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Storage

To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box

with a desiccant . The recommended storage temperature range is 5C to 30C and a maximumhumidity of 50%.

Use Precaution after Opening the Packaging

Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may

affect the light output efficiency.

Pay attention to the following:

a. Soldering should be done immediately after opening the package (within 24Hrs).

b. Required conditions after opening the package

- Sealing

- Temperature : 5 ~ 40 Humidity : less than 30%

c. If the package has been opened more than 1 week or the color of the desiccant changes,

components should be dried for 10-12hr at 605

Do not apply mechanical force or excess vibration during the cooling process to normal

temperature after soldering.

Do not rapidly cool device after soldering.

Components should not be mounted on warped (non coplanar) portion of PCB.

Radioactive exposure is not considered for the products listed here in.

Gallium arsenide is used in some of the products listed in this publication. These products are

dangerous if they are burned or shredded in the process of disposal. It is also dangerous to

drink the liquid or inhale the gas generated by such products when chemically disposed of.

This device should not be used in any type of fluid such as water, oil, organic solvent and etc.

When washing is required, IPA (Isopropyl Alcohol) should be used.

When the LEDs are in operation the maximum current should be decided after measuring the

package temperature.

LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or

more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used

for storage.

The appearance and specifications of the product may be modified for improvement without

notice.

Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.

The slug is isolated from anode electrically.

Therefore, we recommend that you dont isolate the heat sink.

Attaching LEDs, do not use adhesives that outgas organic vapor.

Precaution for use


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The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.

Notes for handling:

Avoid touching silicone resin parts especially with sharp tools such as Pincette

(Tweezers)

Avoid leaving fingerprints on silicone resin parts.

Silicone resin will attract dust so use covered containers for storage.

When populating boards in SMT production, there are basically no restrictions

regarding the form of the pick and place nozzle, except that excessive mechanical

pressure on the surface of the resin must be prevented. It is not recommend to cover the silicone resin of the LEDs with other resin

(epoxy, urethane, etc)

Especially, if a reverse voltage is continuously applied to the product, such operation can

cause the electro-migration resulting in LED damage.

Handling of Silicone resin LEDs


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Revision Profile

No Change Date Change Issue Version

00 The institution of datasheet

01 Add flux rank

02 February.2012 Revision of data

03 March. 2012Datasheet merge between pure and warm

white

Especificações técnicas leds de potencia Z7

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